Laser Beam Joining of Non-Oxidic Ceramics for Ultra High Temperature Resistant Joints

Year
2004
Author(s)
Wolfgang Lippmann - University of Technology Dresden (TUD)
Jürgen Knorr - University of Technology Dresden (TUD)
Regine Wolf - University of Technology Dresden (TUD)
Anne-Maria Reinecke - University of Technology Dresden (TUD),
Roland Rasper - University of Technology Dresden (TUD)
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Abstract
The excellent technical properties of silicon carbide (SiC) and silicon nitride (Si3N4) ceramics, such as resistance to extreme temperatures, oxidation, mechanical wear, aggressive chemical substances and radioactive radiation and also its high thermal conductivity and good temperature-shock resistance, make these ceramics ideally suited for use in the field of nuclear technology. However, their practical use has been limited so far because of the unavailability of effective joining techniques for these ceramics, especially for high temperature applications. A new joining technology (CERALINK@) has been developed in a network project which allowed high temperature resistant and vacuum-tight joining of SiC or Si3N4 ceramics. A power laser is used as heat source, which makes it possible to join ceramic components in free atmosphere in combination with a pure oxidic braze filler. As no furnace is necessary, there are no limitations on the component dimensions by the furnace-geometry. During the joining process, the heated area can be limited to the seam area so that this technology can also be used to encapsulate materials with a low melting point. The seam has a high mechanical strength, it is resistant to a wide range of chemicals and radiation and it is also vacuum-tight. The temperature resistance can be varied by variation of the braze filler composition – usually between 1,400 °C and >1,600 °C. Beside the optimum filler it is also important to select the suitable laser wavelength. The paper will demonstrate the influence of different wave lengths, i. e. various laser types, on the seam quality. Examples are chosen to illustrate the strengths and limitations of the new technology.