RADIATION LEVEL CHANGES AT RAM PACKAGE SURFACES

Year
2010
Author(s)
Erich Opperman - Savannah River Nuclear Solutions, Aiken SC
Mark Hawk - Oak Ridge National Laboratory
Ashok Kapoor - Office of Packaging and Transportation Safety, Washington DC
Ronald Natali - R.B. Natali Consulting, Inc. Richmond, Utah
Abstract
This paper will explore design considerations required to meet the regulations that limit radiation level variations at external surfaces of radioactive material (RAM) packages. The radiation level requirements at package surfaces (e.g. TS-R-1 paragraphs 531 and 646) invoke not only maximum radiation levels, but also strict limits on the allowable increase in the radiation level during transport. This paper will explore the regulatory requirements by quantifying the amount of near surface movement and/or payload shifting that results in a 20% increase in the radiation level at the package surface. Typical IP-2, IP-3, Type A and Type B packaging and source geometries will be illustrated. Variations in surface radiation levels are typically the result of changes in the geometry of the surface due to an impact, puncture or crush event, or shifting and settling of radioactive contents.